BGA inspection
XFPCB reviews BGA inspection against your submitted files, quantity and application requirements before confirming the build plan.
Testing and inspection
X-Ray Inspection in PCB Assembly for Hidden Solder Joints
XFPCB supports X-ray inspection for PCB assemblies with BGA, QFN, LGA and hidden solder joints that cannot be judged by visual inspection.
Technical Requirements for X-Ray Inspection
XFPCB offers X-Ray Inspection support for PCB and PCBA projects that require verified electrical, visual or assembly quality. We can include electrical test, visual inspection, AOI, flying probe, X-ray or customer-defined test requirements during the RFQ stage.
Inspection planning works best when critical nets, hidden solder joints, high-current areas, BGA/QFN components and functional test points are identified early. XFPCB will match the inspection method to the board and assembly requirements.
Send us the files, quantity, material preferences and inspection requirements that matter to your project. XFPCB will confirm what can be manufactured, what affects cost and what needs approval before production.
Engineering Checks
QFN hidden joints
Clear QFN hidden joints requirements help our team quote accurately, prepare production data and reduce avoidable clarification rounds.
void and bridge review
Our engineers confirm details for void and bridge review early, so your team can approve the order with clear next steps.
PCBA quality control
Production notes for PCBA quality control stay connected with the project to support repeat orders and future design revisions.
Production Workflow
- Confirm the electrical and assembly checks required by the project.
- Choose electrical, optical, X-ray or functional checks as appropriate.
- Run inspection and record findings.
- Use the result to support future production files.
XFPCB helps choose practical inspection steps for the board type, assembly complexity and customer acceptance requirements before production is released.
Specification Table
| Project Area | XFPCB Guidance |
|---|---|
| Best use | BGA, QFN, LGA and bottom-terminated components |
| What it helps find | Bridges, opens, voids and alignment issues |
| Customer input | Flag critical components in the assembly drawing |
Key Terms
- Flying probe
- Fixture-free electrical testing using moving probes.
- Netlist
- Expected electrical connection data.
- AOI
- Optical inspection for assembly or PCB defects.
- Functional test
- A test that verifies product behavior, usually defined by the buyer.
Related XFPCB Support
X-Ray Inspection FAQs
What files help XFPCB plan X-Ray Inspection?
Send Gerber files, NC drill files, board outline, stackup notes, material, copper weight, surface finish, quantity and target lead time. For PCBA or assembly-related work, also send the BOM with manufacturer part numbers, pick-and-place data, assembly drawing, DNP notes and test expectations.
Can XFPCB review the files before production?
Yes. XFPCB can review manufacturability and quotation details before production starts. We check material choices, via structures, component package data, tolerance requirements and inspection requirements before release.
Can XFPCB support both prototype and production orders?
In most cases XFPCB can support both stages. Prototype builds help validate the design, while production planning controls repeatability, documentation, component supply and cost for future orders.
How can I reduce quotation delays?
Provide complete files, expected annual or batch quantity, destination country, special standards, inspection needs and the target schedule. If the design is still changing, tell us which details are fixed and which are under review.
Request Testing Support for X-Ray Inspection
Send your project information to XFPCB and our team will review the key manufacturing or assembly details. A complete RFQ helps us respond with a more accurate quote and a clearer production plan.
- For bare PCB projects, include Gerber, drill, stackup, material, copper, finish, quantity and lead time.
- For PCBA projects, include BOM, pick-and-place file, assembly drawing, test notes and approved alternatives.
- For application-specific projects, share operating environment, reliability expectations and packaging needs.