Your Dedicated 4 Layer PCB Manufacturer

The Sweet Spot for Modern Smart Devices

Making the jump from standard double-sided to multilayer? As a specialized 4-layer PCB manufacturer, we help IoT engineers and smart home designers achieve better EMI shielding and cleaner signal routing without breaking the budget. Dedicated GND and VCC planes mean a more stable, certified-ready product.

Quote 4-Layer PCB

Standard 4-Layer Stackup

Our optimized JLC7628 equivalent stackup provides excellent impedance control and structural integrity. Having dedicated internal planes drastically reduces noise and improves EMI compliance for FCC/CE testing.

L1: Top Copper Signal / Components (1 oz / 35µm)

Prepreg (PP) Dielectric (e.g., 2116 or 7628)

L2: Inner Copper 1 Dedicated GND Plane (1 oz / 35µm)

FR-4 Core Rigid Substrate (Provides Mechanical Strength)

L3: Inner Copper 2 Dedicated VCC/Power Plane (1 oz / 35µm)

Prepreg (PP) Dielectric (Matches top PP for symmetry)

L4: Bottom Copper Signal / Components (1 oz / 35µm)

Why Choose 4-Layer?

Superior EMI Shielding: Internal GND and VCC planes absorb radiated noise, making FCC/CE certification much easier.
Easier Routing: Frees up Top and Bottom layers entirely for dense signal routing (like DDR, USB, or SPI).
Better Power Delivery: Solid copper planes reduce voltage drops (IR drop) across the board for high-power MCUs.

XingFeng's Advantages

Cost-Effective: Our optimized panelization makes 4-layer boards surprisingly affordable for mass production.
Impedance Control: Free precise impedance calculation and TDR testing reports for RF/Antenna traces.
Advanced Vias: Reliable blind and buried via support for ultra-compact IoT designs.

Ideal for Smart Ecosystems

IoT Gateways

Stable routing for ESP32/ESP8266 and multi-protocol RF modules (Zigbee, Z-Wave, BLE).

Smart Home Hubs

Compact designs requiring strict EMI control and solid power distribution networks (PDN).

Wearables & Trackers

High-density interconnects allowing smaller form factors and longer battery life.

Frequently Asked Questions

What is the standard thickness for your 4-layer PCBs?

Our most common standard thickness is 1.6mm, which provides excellent mechanical rigidity. However, for wearables and compact IoT devices, we frequently manufacture 1.2mm, 1.0mm, and 0.8mm 4-layer boards at highly competitive prices.

Why should I choose a 4-layer board over a double-sided (2-layer) board?

The primary advantage is routing and signal integrity. On a 2-layer board, power and ground traces take up valuable space and can create noise loops. A 4-layer board dedicates two entire internal layers to GND and VCC. This provides a clean return path for signals, drastically reduces EMI (crucial for passing FCC/CE certifications), and makes routing complex components like BGAs much easier.

Can you guarantee impedance control on 4-layer boards?

Yes. Because the distance between the signal layer (L1/L4) and the reference ground plane (L2/L3) is fixed by the prepreg thickness, 4-layer boards are ideal for impedance-controlled traces (like 50Ω for Wi-Fi/Bluetooth antennas or 90Ω for USB). We will adjust the trace width during CAM engineering to hit your exact target.