24-Hour Quick Turn Available
Fast & Reliable 2 Layer PCB Manufacturer
Your Go-To Double Sided PCB Partner for Startups & Makers
Bring your ideas to life instantly. We provide rapid prototyping and highly reliable standard production for 2-layer PCBs. With standard Plated Through Holes (PTH), via-in-pad capabilities, and our expert free DFM review, we ensure your designs work flawlessly the first time.
Start Prototyping Now
Our 24-Hour Rapid Prototyping Process
1. Upload Gerber
Instant online quoting.
2. Free DFM
Expert engineering review.
3. 24h Fab
High-speed production.
4. Fast Ship
DHL/FedEx direct delivery.
Standard Features Included
- Plated Through Holes (PTH): Reliable via plating for robust double-sided routing.
- Via-in-Pad Capabilities: Perfect for tight QFN or BGA component layouts.
- Impedance Control: ±10% tolerance for USB, HDMI, and high-speed data lines.
Free Engineering DFM
- Trace/Space Check: Preventing acid traps and ensuring manufacturability.
- Drill Registration: Optimizing annular rings to prevent breakout during drilling.
- First Time Right: We fix minor Gerber issues for free so you don't waste time.
Empowering Creators & Engineers
Arduino / Pi Shields
Rapidly prototype expansion boards for open-source hardware ecosystems.
Consumer Gadgets
Smart home switches, wearables, and IoT devices requiring dense 2-layer routing.
Smart Toys & Drones
Highly reliable double-sided boards for motor controllers and RF receivers.
Frequently Asked Questions
What is the standard copper thickness for your 2-layer boards?
Our standard copper thickness is 1 oz (35 µm) for both the top and bottom layers, which is perfect for most digital and low-power analog circuits. We also offer 2 oz or higher for power electronics upon request.
Do you provide electrical testing for prototype boards?
Yes! We provide 100% electrical testing (Flying Probe for prototypes, E-test fixtures for volume) on all our 2-layer double-sided boards. We guarantee zero open/short circuits before shipping.
Can you do via-in-pad for my BGA components?
Absolutely. While standard 2-layer boards typically route out of the pad, we fully support via-in-pad technology with epoxy filling and copper capping if your dense BGA or QFN design requires it.