Fab-process articles for PCB manufacturing - how XFPCB builds boards from CAM through surface finish, which process choices affect yield, and what belongs in clear fabrication notes.
China fab DFM guide: why green DRC still draws CAM EQs, how process sheets redefine DFF+DFA, IPC class cost traps, shop-floor failure modes, and finish/copper/file levers that hide cost.
Read articleChina fab quick-turn PCB guide for NPI sourcing: what expedite really buys, layer/material/impedance lead-time ranges, prototype vs pilot vs volume, CAM holds, and the file package that stays in the fast queue.
Read articleManufacturing emphasizes the production sequence and factory workflow. Tech goes deeper into materials physics and capability detail behind those process steps.
Start with the PCB Fabrication Process page, then use Manufacturing articles for deeper step-by-step context tied to RFQ and DFM decisions.